Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10607959 | Discharge examination device, wire-bonding apparatus, and discharge examination method | Hiroaki Yoshino, Yuki Sekine | 2020-03-31 |
| 10410992 | Ball forming device, wire-bonding apparatus, and ball formation method | Yoshihito Hagiwara, Tatsuyuki Sunada | 2019-09-10 |
| 6491203 | Wire bonding apparatus | Yoshimitsu Terakado | 2002-12-10 |
| 6129255 | Wire bonding apparatus | Yoshimitsu Terakado, Shigeru Shiozawa | 2000-10-10 |
| 5988482 | Discharge abnormality detection device and method for use in wire bonding apparatus | Yoshimitsu Terakado | 1999-11-23 |
| 5897049 | Method for wire-bonding a covered wire | Osamu Nakamura | 1999-04-27 |
| 5891796 | Method for wire-bonding a covered wire | Osamu Nakamura | 1999-04-06 |
| 5816480 | Method for cleaning a bonding tool used on covered bonding wires | Osamu Nakamura | 1998-10-06 |
| 5797388 | Wire-bonding apparatus and method using a covered wire | Osamu Nakamura | 1998-08-25 |
| 5776786 | Method for wire-bonding a covered wire | Osamu Nakamura | 1998-07-07 |
| 5723364 | Method for wire-bonding a covered wire | Osamu Nakamura | 1998-03-03 |
| 5214259 | Method and apparatus for forming a ball at a bonding wire end | Yoshimitsu Terakado | 1993-05-25 |