Issued Patents All Time
Showing 1–25 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6645346 | Workpiece holding device for a bonding apparatus | Tatsunari Mii, Shigeru Shiozawa | 2003-11-11 |
| 6595400 | Wire bonding apparatus | Tooru Mochida, Tatsunari Mii, Shigeru Shiozawa | 2003-07-22 |
| 6502738 | Wire bonding apparatus | Tooru Mochida, Koichi Takahashi | 2003-01-07 |
| 6491203 | Wire bonding apparatus | Kazumasa Sasakura | 2002-12-10 |
| 6439496 | Spool holder structure for a wire bonder | Takatoshi Kawamura, Tadashi Akiike | 2002-08-27 |
| 6141599 | Method for setting conveying data for a lead frame | Toru Mochida, Masayuki Seguro | 2000-10-31 |
| 6129255 | Wire bonding apparatus | Kazumasa Sasakura, Shigeru Shiozawa | 2000-10-10 |
| 5988482 | Discharge abnormality detection device and method for use in wire bonding apparatus | Kazumasa Sasakura | 1999-11-23 |
| 5975835 | Lead frame conveying method and conveying apparatus | Toru Mochida, Masayuki Seguro, Shigeru Shiozawa | 1999-11-02 |
| 5903463 | Raising-and-lowering data setting method for magazine elevator device | Masayuki Seguro, Toru Mochida | 1999-05-11 |
| 5524811 | Wire bonding method | Kazuo Sugiura, Tooru Mochida, Tatsunari Mii | 1996-06-11 |
| 5485063 | Motor control circuit for a wire bonding apparatus | Tooru Mochida, Hijiri Hayashi | 1996-01-16 |
| 5468927 | Wire bonding apparatus | — | 1995-11-21 |
| 5386936 | Wire bonding method | Tooru Mochida | 1995-02-07 |
| 5287064 | Bonding point polarity determining apparatus | Tooru Mochida | 1994-02-15 |
| 5221037 | Wire bonding method and apparatus | Kazuo Sugiura | 1993-06-22 |
| 5219112 | Wire bonding apparatus | Tooru Mochida, Akihiro Hirayanagi | 1993-06-15 |
| 5214259 | Method and apparatus for forming a ball at a bonding wire end | Kazumasa Sasakura | 1993-05-25 |
| 5207370 | Wire bonding method and apparatus | Tooru Mochida, Akihiro Hirayanagi | 1993-05-04 |
| 5192018 | Wire bonding method | Nobuto Yamazaki | 1993-03-09 |
| 5123585 | Wire bonding method | Shinichi Kumazawa, Nobuto Yamazaki | 1992-06-23 |
| 5058797 | Detection method for wire bonding failures | Tohru Mochida, Nobuto Yamazaki | 1991-10-22 |
| 5046654 | Ultrasonic wire bonding apparatus | Nobuto Yamazaki, Yuji Ohashi, Hijiri Hayashi | 1991-09-10 |
| 5046655 | Device for detecting height of bonding surface | Yuji Ohashi, Minoru Torihata, Hiroshi Ushiki | 1991-09-10 |
| 5024367 | Wire bonding method | Nobuto Yamazaki | 1991-06-18 |