Issued Patents All Time
Showing 1–25 of 29 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8815732 | Wire bonding method and semiconductor device | Shinsuke Tei, Hayato Kiuchi | 2014-08-26 |
| 8678266 | Wire bonding method | Toshihiko Toyama | 2014-03-25 |
| 8232656 | Semiconductor device | Shinsuke Tei, Hayato Kiuchi | 2012-07-31 |
| 8143155 | Wire bonding method and semiconductor device | Shinsuke Tei, Hayato Kiuchi | 2012-03-27 |
| 7934634 | Wire bonding method | Tishihiko Toyama, Shinsuke Tei | 2011-05-03 |
| 7910472 | Method of manufacturing semiconductor device | Toshihiko Toyama, Hiroaki Yoshino | 2011-03-22 |
| 7851347 | Wire bonding method and semiconductor device | Shinsuke Tei, Hayato Kiuchi | 2010-12-14 |
| 7821140 | Semiconductor device and wire bonding method | Hayato Kiuchi | 2010-10-26 |
| 7808116 | Semiconductor device and wire bonding method | Toshihiko Toyama, Horoaki Yoshino | 2010-10-05 |
| 7661576 | Wire bonding method | Shinichi Akiyama | 2010-02-16 |
| 7621436 | Wire bonding method | Toshihiko Toyama, Hiroaki Yoshino | 2009-11-24 |
| 7617966 | Semiconductor device | Shinichi Akiyama | 2009-11-17 |
| 7458498 | Semiconductor device and a wire bonding method | Shinichi Akiyama | 2008-12-02 |
| 7044357 | Bump formation method and wire bonding method | — | 2006-05-16 |
| 7025247 | Wire bonding method | Hiroshi Watanabe | 2006-04-11 |
| 6645346 | Workpiece holding device for a bonding apparatus | Shigeru Shiozawa, Yoshimitsu Terakado | 2003-11-11 |
| 6595400 | Wire bonding apparatus | Yoshimitsu Terakado, Tooru Mochida, Shigeru Shiozawa | 2003-07-22 |
| 6467678 | Wire bonding method and apparatus | Tooru Mochida, Nobuaki Hirai | 2002-10-22 |
| 6325269 | Wire bonding capillary | Takesi Suzuki, Mamoru Sakurai, Minoru Torihata | 2001-12-04 |
| 6173885 | Method for forming a ball in wire bonding | Kuniyuki Takahashi | 2001-01-16 |
| 6080651 | Wire bonding method | Kuniyuki Takahashi, Tooru Mochida, Nobuto Yamazaki | 2000-06-27 |
| 6041995 | Wire bonding method | Kuniyuki Takahashi | 2000-03-28 |
| 6036080 | Wire bonding method | Kuniyuki Takahashi, Minoru Torihata, Kazumasa Kimura | 2000-03-14 |
| 5958259 | Method for forming a ball in wire bonding | Fumio Miyano | 1999-09-28 |
| 5906308 | Capillary for use in a wire bonding apparatus | Nobuto Yamazaki, Minoru Torihata | 1999-05-25 |