Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7658313 | Ball forming device in a bonding apparatus and ball forming method | Shinichi Nishiura | 2010-02-09 |
| 7644852 | Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatus | Shinichi Nishiura, Masayuki Horino | 2010-01-12 |
| 7299966 | Initial ball forming method for wire bonding wire and wire bonding apparatus | Shinichi Nishiura, Mitsuaki Sakakura | 2007-11-27 |
| 6874673 | Initial ball forming method for wire bonding wire and wire bonding apparatus | Shinichi Nishiura, Mitsuaki Sakakura | 2005-04-05 |
| 6491202 | Wire bonding apparatus and method | Ryuichi Kyomasu, Toshihiko Toyama | 2002-12-10 |
| 6467679 | Wire bonding method | Ryuichi Kyomasu, Toshihiko Toyama | 2002-10-22 |
| 5957371 | Method and apparatus for forming a ball in wire bonding | Kuniyuki Takahashi | 1999-09-28 |
| 5958259 | Method for forming a ball in wire bonding | Tatsunari Mii | 1999-09-28 |