Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374653 | Manufacturing method of semiconductor device and wire bonding apparatus | Shinsuke Tei | 2025-07-29 |
| 12191173 | Wire tension adjustment method and wire tension adjuster | Yuu Hasegawa | 2025-01-07 |
| 12087725 | Wire bonding apparatus, method for measuring opening amount of clamp apparatus, and method for calibrating clamp apparatus | — | 2024-09-10 |
| 8678266 | Wire bonding method | Tatsunari Mii | 2014-03-25 |
| 8191759 | Wire bonding apparatus and wire bonding method | Shinsuke Tei | 2012-06-05 |
| 7910472 | Method of manufacturing semiconductor device | Tatsunari Mii, Hiroaki Yoshino | 2011-03-22 |
| 7808116 | Semiconductor device and wire bonding method | Tatsunari Mii, Horoaki Yoshino | 2010-10-05 |
| 7621436 | Wire bonding method | Tatsunari Mii, Hiroaki Yoshino | 2009-11-24 |
| 6491202 | Wire bonding apparatus and method | Ryuichi Kyomasu, Fumio Miyano | 2002-12-10 |
| 6467679 | Wire bonding method | Ryuichi Kyomasu, Fumio Miyano | 2002-10-22 |