HY

Horoaki Yoshino

SH Shinkawa: 1 patents #131 of 229Top 60%
📍 Akishima, JP: #328 of 519 inventorsTop 65%
Overall (All Time): #3,304,878 of 4,157,543Top 80%
1
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Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
7808116 Semiconductor device and wire bonding method Tatsunari Mii, Toshihiko Toyama 2010-10-05