Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6871772 | Wire bonding apparatus | Yutaka Kondo | 2005-03-29 |
| 6863206 | Bonding apparatus | Yasushi Suzuki | 2005-03-08 |
| 6814121 | Bonding apparatus | Shigeru Hayata, Satoshi Enokido, Toshiaki Sasano | 2004-11-09 |
| 6766936 | Transducer and a bonding apparatus using the same | Osamu Kakutani, Yoshihiko Seino | 2004-07-27 |
| 6762848 | Offset measurement method, tool position detection method and bonding apparatus | Shigeru Hayata, Satoshi Enokido, Toshiaki Sasano | 2004-07-13 |
| 6727666 | XY table for a semiconductor manufacturing apparatus | Hiroto Urabayashi, Minoru Torihata, Kuniyuki Takahashi, Toshimichi Miyahara | 2004-04-27 |
| 6719183 | Transducer and a bonding apparatus using the same | Yoshihiko Seino | 2004-04-13 |
| 6491202 | Wire bonding apparatus and method | Fumio Miyano, Toshihiko Toyama | 2002-12-10 |
| 6467673 | Bonding apparatus and bonding method | Satoshi Enokido, Shigeru Hayata, Toshiaki Sasano | 2002-10-22 |
| 6467679 | Wire bonding method | Fumio Miyano, Toshihiko Toyama | 2002-10-22 |
| 6464126 | Bonding apparatus and bonding method | Shigeru Hayata, Satoshi Enokido, Toshiaki Sasano | 2002-10-15 |
| 6449516 | Bonding method and apparatus | Motohiko Kato | 2002-09-10 |
| 6422448 | Ultrasonic horn for a bonding apparatus | Shinichi Nishiura | 2002-07-23 |
| 6189761 | Wire bonding apparatus | — | 2001-02-20 |
| 6135338 | Capillary holding structure for ultrasonic horn | Minoru Kawagishi, Mitsuaki Sakakura, Tadashi Akiike | 2000-10-24 |
| 5486733 | Bonding apparatus | Nobuto Yamazaki | 1996-01-23 |
| 5411195 | Bonding apparatus | Nobuto Yamazaki | 1995-05-02 |
| 5385288 | Bonding apparatus | Mitsuaki Sakakura, Minoru Kawagishi, Tadashi Akiike | 1995-01-31 |
| 5310702 | Method of preventing short-circuiting of bonding wires | Toshiki Yoshida, Toshihiro Satoh | 1994-05-10 |
| 4763827 | Manufacturing method | Kenji Watanabe, Isamu Yamazaki, Nobuhiro Takasugi, Tsutomu Mimata, Osamu Kakutani | 1988-08-16 |
| 4674670 | Manufacturing apparatus | Kenji Watanabe, Isamu Yamazaki, Nobuhiro Takasugi, Tsutomu Mimata, Osamu Kakutani | 1987-06-23 |
| 4347964 | Wire bonding apparatus | Nobuhiro Takasugi | 1982-09-07 |
| 4315199 | Control circuit for a positioning device using a d-c motor | Shuichi Hanashima, Yoshikazu Suzumura | 1982-02-09 |