Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6760968 | Die packing device | Osamu Kakutani | 2004-07-13 |
| 6579057 | Conveyor apparatus for dies and small components | Hiroshi Watanabe, Yasushi Sato | 2003-06-17 |
| 6505397 | Die holding mechanism for a die with connecting wires thereon | Osamu Kakutani | 2003-01-14 |
| 6383844 | Multi-chip bonding method and apparatus | Osamu Kakutani | 2002-05-07 |
| 5059559 | Method of aligning and bonding tab inner leads | Michio Takahashi, Tooru Mita, Yasuo Nakagawa, Toshimitsu Hamada, Hisafumi Iwata +6 more | 1991-10-22 |
| 5015425 | Manufacturing apparatus | Toshihide Uematsu, Katsuhiro Tabata | 1991-05-14 |
| 4950866 | Method and apparatus of bonding insulated and coated wire | Toosaku Kojima, Susumu Okikawa, Michio Okamoto, Takeshi Kawana, Satoshi URAYAMA | 1990-08-21 |
| 4890780 | Manufacturing apparatus | Toshihide Uematsu, Katsuhiro Tabata | 1990-01-02 |
| 4763827 | Manufacturing method | Kenji Watanabe, Isamu Yamazaki, Ryuichi Kyomasu, Nobuhiro Takasugi, Osamu Kakutani | 1988-08-16 |
| 4674670 | Manufacturing apparatus | Kenji Watanabe, Isamu Yamazaki, Ryuichi Kyomasu, Nobuhiro Takasugi, Osamu Kakutani | 1987-06-23 |
| 4405242 | Electronic device and method of fabricating the same | Hideki Kosaka, Tsuyoshi Shimizu, Hideharu Yamamoto, Kaoru Itoh, Yasuhusa Shima | 1983-09-20 |
| 4348751 | Electronic device and method of fabricating the same | Hideki Kosaka, Tsuyoshi Shimizu, Hideharu Yamamoto, Kaoru Itoh, Yasuhusa Shima | 1982-09-07 |