Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6419149 | Method for producing wiring layer transfer composite | Kentaro Yano, Noboru Hanai | 2002-07-16 |
| 6032362 | Method for producing a heat spreader and semiconductor device with a heat spreader | Saburou Kitaguchi | 2000-03-07 |
| 5844310 | Heat spreader semiconductor device with heat spreader and method for producing same | Saburou Kitaguchi | 1998-12-01 |
| 5285949 | Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method | Michio Tanimoto | 1994-02-15 |
| 5152450 | Wire-bonding method, wire-bonding apparatus,and semiconductor device produced by the wire-bonding method | Michio Tanimoto | 1992-10-06 |
| 5031821 | Semiconductor integrated circuit device, method for producing or assembling same, and producing or assembling apparatus for use in the method | Tsuyoshi Kaneda, Hiroshi Mikino, Hiroshi Watanabe, Toshihiro Satou, Atsushi Onodera +1 more | 1991-07-16 |
| 4998002 | Wire-bonding method, wire-bonding apparatus, and semiconductor device produced by the wire-bonding method | Michio Tanimoto | 1991-03-05 |
| 4976393 | Semiconductor device and production process thereof, as well as wire bonding device used therefor | Makoto Nakajima, Yoshio Ohashi, Toshio Chuma, Kazuo Hatori, Isao Araki +3 more | 1990-12-11 |
| 4950866 | Method and apparatus of bonding insulated and coated wire | Toosaku Kojima, Tsutomu Mimata, Michio Okamoto, Takeshi Kawana, Satoshi URAYAMA | 1990-08-21 |
| 4845543 | Semiconductor device and method of manufacturing the same | Hiroshi Mikino, Hiromichi Suzuki, Wahei Kitamura, Daiji Sakamoto | 1989-07-04 |
| 4791472 | Lead frame and semiconductor device using the same | Akira Miyairi | 1988-12-13 |
| 4564734 | Wire bonder | — | 1986-01-14 |
| 4326215 | Encapsulated semiconductor device with a metallic base plate | Hiromichi Suzuki | 1982-04-20 |