Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6089439 | Wire cutting and feeding device for use in wire bonding apparatus | Minoru Torihata, Takayuki Iiyama | 2000-07-18 |
| 6080651 | Wire bonding method | Kuniyuki Takahashi, Tooru Mochida, Tatsunari Mii | 2000-06-27 |
| 5981371 | Bump forming method | Motohiko Kato | 1999-11-09 |
| 5906308 | Capillary for use in a wire bonding apparatus | Minoru Torihata, Tatsunari Mii | 1999-05-25 |
| 5884830 | Capillary for a wire bonding apparatus | Minoru Torihata, Tatsunari Mii | 1999-03-23 |
| 5870489 | Ball detection method and apparatus for wire-bonded parts | Yoshiyuki Ogata | 1999-02-09 |
| 5562396 | Non-contact type moving table | Minoru Torihata, Shinji Maki | 1996-10-08 |
| 5562395 | Non-contact type moving table | Minoru Torihata, Shinji Maki | 1996-10-08 |
| 5501569 | Non-contact type moving table | Minoru Torihata, Shinji Maki | 1996-03-26 |
| 5486733 | Bonding apparatus | Ryuichi Kyomasu | 1996-01-23 |
| 5485398 | Method and apparatus for inspecting bent portions in wire loops | Shinichi Kumazawa | 1996-01-16 |
| 5439341 | Non-contact type moving table | Minoru Torihata, Shinji Maki | 1995-08-08 |
| 5431527 | Non-contact type moving table system | Minoru Torihata, Shinji Maki | 1995-07-11 |
| 5411195 | Bonding apparatus | Ryuichi Kyomasu | 1995-05-02 |
| 5323948 | Wire clamper | Koichi Harada, Minoru Torihata, Mitsuaki Sakakura, Takayuki Iiyama | 1994-06-28 |
| 5297722 | Wire bonding method and apparatus | Kuniyuki Takahashi | 1994-03-29 |
| 5275324 | Wire bonding apparatus | Mitsuaki Sakakura, Koichi Harada, Minoru Torihata | 1994-01-04 |
| 5259548 | Wire bonding method | Kazuo Sugiura, Minoru Torihata, Kuniyuki Takahashi, Tatsunari Mii | 1993-11-09 |
| 5223063 | Method for bonding semiconductor elements to a tab tape | Akihiro Nishimura | 1993-06-29 |
| 5197652 | Wire bonding method and apparatus with lead pressing means | — | 1993-03-30 |
| 5192018 | Wire bonding method | Yoshimitsu Terakado | 1993-03-09 |
| 5157985 | X-Y table for bonding devices | Minoru Torihata | 1992-10-27 |
| 5156323 | Wire bonding method | Shinichi Kumazawa, Kuniyuki Takahashi | 1992-10-20 |
| 5137201 | Wire bonding method | Kuniyuki Takahashi | 1992-08-11 |
| 5123585 | Wire bonding method | Yoshimitsu Terakado, Shinichi Kumazawa | 1992-06-23 |