Issued Patents All Time
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5106011 | Bump attachment method | Koji Sato | 1992-04-21 |
| 5078312 | Wire bonding method | Yuji Ohashi | 1992-01-07 |
| 5058798 | Method for forming bump on semiconductor elements | Akihiro Nishimura | 1991-10-22 |
| 5058797 | Detection method for wire bonding failures | Yoshimitsu Terakado, Tohru Mochida | 1991-10-22 |
| 5056217 | Method for manufacturing semiconductor elements equipped with leads | Akihiro Nishimura | 1991-10-15 |
| 5046654 | Ultrasonic wire bonding apparatus | Yoshimitsu Terakado, Yuji Ohashi, Hijiri Hayashi | 1991-09-10 |
| 5040293 | Bonding method | Akihiro Nishimura | 1991-08-20 |
| 5024367 | Wire bonding method | Yoshimitsu Terakado | 1991-06-18 |
| 4989756 | Dispensing apparatus | Mitsuru Kagamihara, Minoru Kawagishi | 1991-02-05 |
| 4986460 | Apparatus for manufacturing semiconductor devices | Hiroshi Ushiki, Kenji Katakubo | 1991-01-22 |
| 4975050 | Workpiece heating and feeding device | Hiroshi Ushiki, Kenji Kitakubo | 1990-12-04 |
| 4938383 | Dispenser apparatus | Shigeru Fuke, Akihiro Hirayanagi | 1990-07-03 |
| 4936944 | Wafer supplying apparatus | Shigeru Fuke, Kazuo Sugiura | 1990-06-26 |
| 4932584 | Method of wire bonding | Takeshi Hasegawa, Junkichi Enomoto, Yoshimitsu Terakado, Shinichi Kumazawa | 1990-06-12 |
| 4913763 | Die bonding apparatus | Minoru Kawagishi | 1990-04-03 |
| 4913336 | Method of tape bonding | — | 1990-04-03 |