Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11302666 | Mounting head | Manato Nishide, Kohei Seyama | 2022-04-12 |
| 6362014 | Bonding apparatus | Kuniyuki Takahashi | 2002-03-26 |
| 6302312 | Bonding apparatus and method | Kuniyuki Takahashi | 2001-10-16 |
| 6206266 | Control method for wire bonding apparatus | Kuniyuki Takahashi | 2001-03-27 |
| 6119914 | Wire bonding apparatus | Kuniyuki Takahashi | 2000-09-19 |
| 6119917 | Wire bonding apparatus and bonding load correction method for the same | Kuniyuki Takahashi | 2000-09-19 |
| 6095396 | Bonding load correction method and wire bonding apparatus | Kuniyuki Takahashi | 2000-08-01 |
| 6070778 | Wire bonding apparatus and control method thereof | Kuniyuki Takahashi | 2000-06-06 |
| 5949208 | Circuit and method for controlling a DC motor | Kuniyuki Takahashi | 1999-09-07 |
| 5485063 | Motor control circuit for a wire bonding apparatus | Tooru Mochida, Yoshimitsu Terakado | 1996-01-16 |
| 5046654 | Ultrasonic wire bonding apparatus | Nobuto Yamazaki, Yoshimitsu Terakado, Yuji Ohashi | 1991-09-10 |
| 5016803 | Wire bonding apparatus | Yuji Ohashi, Yoshimitsu Terakado | 1991-05-21 |