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Wire bonding apparatus |
Hiroshi Ushiki |
2003-09-16 |
| 6595400 |
Wire bonding apparatus |
Yoshimitsu Terakado, Tatsunari Mii, Shigeru Shiozawa |
2003-07-22 |
| 6502738 |
Wire bonding apparatus |
Yoshimitsu Terakado, Koichi Takahashi |
2003-01-07 |
| 6467678 |
Wire bonding method and apparatus |
Tatsunari Mii, Nobuaki Hirai |
2002-10-22 |
| 6343733 |
Wire bonding method |
Shinichi Nishiura |
2002-02-05 |
| 6250539 |
Wire bonding method |
Shinichi Nishiura |
2001-06-26 |
| 6222274 |
Bonding wire loop shape for a semiconductor device |
Shinichi Nishiura |
2001-04-24 |
| 6213384 |
Wire bonding method |
Shinichi Nishiura |
2001-04-10 |
| 6080651 |
Wire bonding method |
Kuniyuki Takahashi, Tatsunari Mii, Nobuto Yamazaki |
2000-06-27 |
| 6045318 |
Lead frame supplying method and apparatus |
Shinichi Baba |
2000-04-04 |
| 6033932 |
Lead frame supplying apparatus |
Shinichi Baba |
2000-03-07 |
| 6001670 |
Lead frame supplying method |
Shinichi Baba |
1999-12-14 |
| 5989995 |
Semiconductor device and wire bonding method therefor |
Shinichi Nishiura |
1999-11-23 |
| 5967401 |
Wire bonding method |
Shinichi Nishiura |
1999-10-19 |
| 5961029 |
Wire bonding method |
Shinichi Nishiura |
1999-10-05 |
| 5524811 |
Wire bonding method |
Yoshimitsu Terakado, Kazuo Sugiura, Tatsunari Mii |
1996-06-11 |
| 5485063 |
Motor control circuit for a wire bonding apparatus |
Yoshimitsu Terakado, Hijiri Hayashi |
1996-01-16 |
| 5386936 |
Wire bonding method |
Yoshimitsu Terakado |
1995-02-07 |
| 5364009 |
Ultrasonic wire bonding method |
Kuniyuki Takahashi |
1994-11-15 |
| 5287064 |
Bonding point polarity determining apparatus |
Yoshimitsu Terakado |
1994-02-15 |
| 5219112 |
Wire bonding apparatus |
Yoshimitsu Terakado, Akihiro Hirayanagi |
1993-06-15 |
| 5207370 |
Wire bonding method and apparatus |
Yoshimitsu Terakado, Akihiro Hirayanagi |
1993-05-04 |