Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5219112 | Wire bonding apparatus | Tooru Mochida, Yoshimitsu Terakado | 1993-06-15 |
| 5207370 | Wire bonding method and apparatus | Tooru Mochida, Yoshimitsu Terakado | 1993-05-04 |
| 4938383 | Dispenser apparatus | Nobuto Yamazaki, Shigeru Fuke | 1990-07-03 |