Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7658313 | Ball forming device in a bonding apparatus and ball forming method | Fumio Miyano | 2010-02-09 |
| 7644852 | Bonding apparatus, ball forming device in said bonding apparatus, and ball forming method using said bonding apparatus | Fumio Miyano, Masayuki Horino | 2010-01-12 |
| 7299966 | Initial ball forming method for wire bonding wire and wire bonding apparatus | Mitsuaki Sakakura, Fumio Miyano | 2007-11-27 |
| 6874673 | Initial ball forming method for wire bonding wire and wire bonding apparatus | Mitsuaki Sakakura, Fumio Miyano | 2005-04-05 |
| 6845897 | Ultrasonic horn for a bonding apparatus | — | 2005-01-25 |
| 6784394 | Ball formation method and ball forming device used in a wire bonding apparatus | — | 2004-08-31 |
| 6758383 | Transducer for a bonding apparatus | Kazuhiro Ootaka | 2004-07-06 |
| 6422448 | Ultrasonic horn for a bonding apparatus | Ryuichi Kyomasu | 2002-07-23 |
| 6343733 | Wire bonding method | Tooru Mochida | 2002-02-05 |
| 6315190 | Wire bonding method | — | 2001-11-13 |
| 6305594 | Wire bonding method and apparatus | Toru Mochida | 2001-10-23 |
| 6270000 | Wire bonding method | — | 2001-08-07 |
| 6250539 | Wire bonding method | Tooru Mochida | 2001-06-26 |
| 6222274 | Bonding wire loop shape for a semiconductor device | Tooru Mochida | 2001-04-24 |
| 6213384 | Wire bonding method | Tooru Mochida | 2001-04-10 |
| 6182885 | Wire bonding method | Nobuo Takeuchi | 2001-02-06 |
| 6164518 | Wire bonding method and apparatus | Toru Mochida | 2000-12-26 |
| 6112974 | Wire bonding method | Nobuo Takeuchi | 2000-09-05 |
| 5989995 | Semiconductor device and wire bonding method therefor | Tooru Mochida | 1999-11-23 |
| 5967401 | Wire bonding method | Tooru Mochida | 1999-10-19 |
| 5961029 | Wire bonding method | Tooru Mochida | 1999-10-05 |