Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046574 | Ultrasonic horn and manufacturing apparatus of semiconductor device | Yuhei Ito, Nobuyuki Aoyagi, Takuya Asami, Hikaru Miura | 2024-07-23 |
| 9362251 | Antioxidant gas blow-off unit | Toru Maeda | 2016-06-07 |
| 9044821 | Antioxidant gas supply unit | Toru Maeda | 2015-06-02 |
| 7299966 | Initial ball forming method for wire bonding wire and wire bonding apparatus | Shinichi Nishiura, Fumio Miyano | 2007-11-27 |
| 6874673 | Initial ball forming method for wire bonding wire and wire bonding apparatus | Shinichi Nishiura, Fumio Miyano | 2005-04-05 |
| 6578753 | Ultrasonic transducer for a bonding apparatus and method for manufacturing the same | — | 2003-06-17 |
| 6135338 | Capillary holding structure for ultrasonic horn | Ryuichi Kyomasu, Minoru Kawagishi, Tadashi Akiike | 2000-10-24 |
| 5904286 | Capillary holding structure for an ultrasonic horn | Minoru Kawagishi, Tadashi Akiike | 1999-05-18 |
| 5540807 | Bonding apparatus | Tadashi Akiike, Minoru Kawagishi | 1996-07-30 |
| 5385288 | Bonding apparatus | Ryuichi Kyomasu, Minoru Kawagishi, Tadashi Akiike | 1995-01-31 |
| 5368216 | Capillary-retaining structure for an ultrasonic horn | Yuji Tanaka, Junkichi Enomoto, Syoji Ito | 1994-11-29 |
| 5323948 | Wire clamper | Nobuto Yamazaki, Koichi Harada, Minoru Torihata, Takayuki Iiyama | 1994-06-28 |
| 5275324 | Wire bonding apparatus | Nobuto Yamazaki, Koichi Harada, Minoru Torihata | 1994-01-04 |