Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12046574 | Ultrasonic horn and manufacturing apparatus of semiconductor device | Yuhei Ito, Mitsuaki Sakakura, Takuya Asami, Hikaru Miura | 2024-07-23 |
| 11824038 | Wire bonding apparatus | Shigeru Amemiya | 2023-11-21 |
| 11376627 | Ultrasonic horn | Hikaru Miura, Takuya Asami, Yasumoto Togashi | 2022-07-05 |
| 8800843 | Bonding apparatus | Kohei Seyama | 2014-08-12 |
| 8540135 | Bonding method, bonding apparatus, and manufacturing method of semiconductor device using the same | Hiroaki Yoshino | 2013-09-24 |
| 8292160 | Method of manufacturing semiconductor device, and bonding apparatus | Yusuke Maruya | 2012-10-23 |
| 8181527 | Method and apparatus for pass/fail determination of bonding and bonding apparatus | Kohei Seyama | 2012-05-22 |
| 7754410 | Production method of static charge image developing toner and screen device | Shingo Ishiyama | 2010-07-13 |
| 5881888 | Wafer die pick-up method | Masaki Ohkawara | 1999-03-16 |
| 5372239 | Apparatus for conveying plate-form articles | Hisashi Ueda, Tadayuki Ueda | 1994-12-13 |
| 5332079 | Apparatus for conveying plate-form articles | Hisashi Ueda, Tadayuki Ueda | 1994-07-26 |
| 5307420 | Method and apparatus for monitoring plates in marking device | Noboru Fujino, Tohru Takamura | 1994-04-26 |