Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5613000 | Method and apparatus for changing the data setting modes in a bonding machine | Kuniyuki Takahashi | 1997-03-18 |
| 5485398 | Method and apparatus for inspecting bent portions in wire loops | Nobuto Yamazaki | 1996-01-16 |
| 5156323 | Wire bonding method | Kuniyuki Takahashi, Nobuto Yamazaki | 1992-10-20 |
| 5123585 | Wire bonding method | Yoshimitsu Terakado, Nobuto Yamazaki | 1992-06-23 |
| 4932584 | Method of wire bonding | Nobuto Yamazaki, Takeshi Hasegawa, Junkichi Enomoto, Yoshimitsu Terakado | 1990-06-12 |