Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7087457 | Die bonding method and apparatus | Hisashi Arai | 2006-08-08 |
| 6122332 | Apparatus for reducing impulse noise in high-frequency digital receivers | Hiroaki Haruyama | 2000-09-19 |
| 5870489 | Ball detection method and apparatus for wire-bonded parts | Nobuto Yamazaki | 1999-02-09 |
| 5772040 | Workpiece conveying apparatus used with workpiece inspection device | Hiromi Tomiyama, Satoshi Enokido, Takeyuki Nakagawa | 1998-06-30 |