Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10816322 | Bonding apparatus and method for detecting height of bonding target | Shigeru Hayata | 2020-10-27 |
| 10586781 | Bonding apparatus and method of estimating position of landing point of bonding tool | Shigeru Hayata, Hiroya Yuzawa | 2020-03-10 |
| 5818958 | Wire bend inspection method and apparatus | Takeyuki Nakagawa, Naoki Kanayama | 1998-10-06 |
| 5772040 | Workpiece conveying apparatus used with workpiece inspection device | Yoshiyuki Ogata, Satoshi Enokido, Takeyuki Nakagawa | 1998-06-30 |
| 5583641 | Bonding wire height detection method | Takeyuki Nakagawa, Satoru Nagai | 1996-12-10 |
| 5576828 | Bonding wire detection method | Satoru Nagai | 1996-11-19 |