Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12217996 | Conveying device | Jin Li, Hiroshi Kikuchi | 2025-02-04 |
| 10262968 | Wire bonding apparatus and wire bonding method | Shigeru Hayata | 2019-04-16 |
| 7330582 | Bonding program | Kenji Sugawara | 2008-02-12 |
| 7324683 | Bonding pattern discrimination device | — | 2008-01-29 |
| 7324684 | Bonding apparatus | Kenji Sugawara | 2008-01-29 |
| 7321681 | Bonding pattern discrimination program | — | 2008-01-22 |
| 7224829 | Bonding pattern discrimination method, bonding pattern discrimination device and bonding pattern discrimination program | — | 2007-05-29 |
| 7209583 | Bonding method, bonding apparatus and bonding program | Kenji Sugawara | 2007-04-24 |
| 6814121 | Bonding apparatus | Shigeru Hayata, Ryuichi Kyomasu, Toshiaki Sasano | 2004-11-09 |
| 6762848 | Offset measurement method, tool position detection method and bonding apparatus | Shigeru Hayata, Ryuichi Kyomasu, Toshiaki Sasano | 2004-07-13 |
| 6467673 | Bonding apparatus and bonding method | Ryuichi Kyomasu, Shigeru Hayata, Toshiaki Sasano | 2002-10-22 |
| 6464126 | Bonding apparatus and bonding method | Shigeru Hayata, Ryuichi Kyomasu, Toshiaki Sasano | 2002-10-15 |
| 5772040 | Workpiece conveying apparatus used with workpiece inspection device | Hiromi Tomiyama, Yoshiyuki Ogata, Takeyuki Nakagawa | 1998-06-30 |