Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6814121 | Bonding apparatus | Shigeru Hayata, Ryuichi Kyomasu, Satoshi Enokido | 2004-11-09 |
| 6762848 | Offset measurement method, tool position detection method and bonding apparatus | Shigeru Hayata, Ryuichi Kyomasu, Satoshi Enokido | 2004-07-13 |
| 6467673 | Bonding apparatus and bonding method | Satoshi Enokido, Ryuichi Kyomasu, Shigeru Hayata | 2002-10-22 |
| 6464126 | Bonding apparatus and bonding method | Shigeru Hayata, Ryuichi Kyomasu, Satoshi Enokido | 2002-10-15 |
| 6250534 | Wire bonding method | — | 2001-06-26 |
| 5862974 | Wire bonding method and apparatus | — | 1999-01-26 |
| 5615821 | Wire bonding method and apparatus | — | 1997-04-01 |
| 5583756 | Teaching method and teaching system for a bonding coordinate | — | 1996-12-10 |
| 5579984 | Bonding coordinate teaching method and teaching means | — | 1996-12-03 |