Issued Patents All Time
Showing 1–25 of 30 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10717963 | Method for culturing lactic acid bacteria, and a food and drink product | Masatoshi Nakano, Mika Arifuku, Harumi Mizukoshi, Susumu Mizusawa, Masahiko Ito | 2020-07-21 |
| 10221204 | Preparation method for high-purity 4′-galactosyl-lactose composition | Tetsuya Yamada, Hiroshi Hatano, Hidetsugu Sotoya, Yoko Mori | 2019-03-05 |
| 9482648 | Method for detecting galacto-oligosaccharide | Harumi Mizukoshi | 2016-11-01 |
| 8163534 | Estrogenic substance degradable microorganism and use thereof | Takeshi Yoshimoto, Fumiko Nagai, Junji Fujimoto, Harumi Mizukoshi, Koichi Watanabe +3 more | 2012-04-24 |
| 6901305 | Bonding data setting device and method | Hitoshi Watanabe | 2005-05-31 |
| 6335406 | Method for production of absorbent resin excelling in durability | Kinya Nagasuna, Kenji Kadonaga, Tadao Shimomura | 2002-01-01 |
| 6087002 | Water absorbent resin | Kinya Nagasuna, Takashi Namba, Kenji Kadonaga, Koji Miyake, Tadao Shimomura | 2000-07-11 |
| 6036080 | Wire bonding method | Kuniyuki Takahashi, Minoru Torihata, Tatsunari Mii | 2000-03-14 |
| 5777604 | Touch panel input apparatus performing a sampling operation intermittently | Yoshio Okajima, Tazo Nishida | 1998-07-07 |
| 5634586 | Single point bonding method | Yasushi Suzuki | 1997-06-03 |
| 5599763 | Absorbent material, absorbent body, and method for production thereof | Nobuyuki Harada, Tadao Shimomura | 1997-02-04 |
| 5478912 | Process for producing modified polyaminoamide, modified polyaminoamide produced thereby, and epoxy resin curing agent comprising the said modified polyaminoamide | Takashi Kai, Hitoshi Yano, Ryuichi Ishikawa, Kazuaki Abe, Yoshihiro Arita | 1995-12-26 |
| 5375246 | Back-up power supply apparatus for protection of stored data | Masato Hiramoto | 1994-12-20 |
| 5368918 | Absorbent material comprising absorbent polymeric particulate material coated with synthetic pulp | Nobuyuki Harada, Tadao Shimomura | 1994-11-29 |
| 5250640 | Method for production of particulate hydrogel polymer and absorbent resin | Yoshio Irie, Takumi Hatsuda, Koichi Yonemura | 1993-10-05 |
| 5244735 | Water-absorbent resin and production process | Kinya Nagasuna, Takashi Namba, Kenji Kadonaga, Koji Miyake, Tadao Shimomura | 1993-09-14 |
| 5243577 | Electronic apparatus | Toshiyuki Ueda, Masato Hiramoto | 1993-09-07 |
| 5203443 | Conveying apparatus used in assembling semicondutors | Kiyoshi Toriumi | 1993-04-20 |
| 5195999 | Absorbent body and absorbent article | Nobuyuki Harada, Tadao Shimomura | 1993-03-23 |
| 5164459 | Method for treating the surface of an absorbent resin | Takumi Hatsuda, Kinya Nagasuna | 1992-11-17 |
| 5140076 | Method of treating the surface of an absorbent resin | Takumi Hatsuda, Kinya Nagasuna, Akito Yano | 1992-08-18 |
| 5098775 | Body fluid-absorbing article | Nobuyuki Harada, Yoshihiro Motono, Tadao Shimomura | 1992-03-24 |
| 5079034 | Method for manufacturing a water absorbent composite by applying an aqueous polymerizable solution to a substrate and polymerizing the coating against polymerization inner surfaces | Koji Miyake, Nobuyuki Harada, Tadao Shimomura | 1992-01-07 |
| 5026800 | Water-absorbent resin and production process | Kinya Nagasuna, Takashi Namba, Kenji Kadonaga, Koji Miyake, Tadao Shimomura | 1991-06-25 |
| 5020715 | Bonding method | Akira Komamiya, Takashi Endo | 1991-06-04 |