Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5016803 | Wire bonding apparatus | Yuji Ohashi, Hijiri Hayashi | 1991-05-21 |
| 4932584 | Method of wire bonding | Nobuto Yamazaki, Takeshi Hasegawa, Junkichi Enomoto, Shinichi Kumazawa | 1990-06-12 |