Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9978713 | Method of manufacturing semiconductor device and wire bonding apparatus | Naoki Sekine | 2018-05-22 |
| 9793236 | Wire-bonding apparatus and method of manufacturing semiconductor device | Naoki Sekine, Yasuo Nagashima | 2017-10-17 |
| 9457421 | Wire-bonding apparatus and method of wire bonding | Naoki Sekine, Yong Du | 2016-10-04 |
| 9379086 | Method of manufacturing semiconductor device | Shinji Kumamoto, Naoki Sekine, Yasuo Nagashima | 2016-06-28 |
| 9368471 | Wire-bonding apparatus and method of manufacturing semiconductor device | Shinichi Akiyama, Naoki Sekine | 2016-06-14 |
| 9337166 | Wire bonding apparatus and bonding method | Yoshihito Hagiwara, Naoki Sekine, Koichi Takahashi, Yasuo Nagashima | 2016-05-10 |
| 9028649 | Semiconductor die pick-up apparatus and method of picking up semiconductor die using the same | Shinichi Sasaki, Akiko Fujii | 2015-05-12 |