Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7510958 | Method of manufacturing a semiconductor device including a bump forming process | Tetsuya Iwata | 2009-03-31 |
| 7153764 | Method of manufacturing a semiconductor device including a bump forming process | Tetsuya Iwata | 2006-12-26 |
| 6602738 | Method of manufacturing semiconductor device having tie bars for interconnecting leads | Zhikang Qin | 2003-08-05 |
| 6600218 | Semiconductor device | Fumiaki Aga, Hiroshi Horibe, Yasuhito Suzuki, Akira Takaki | 2003-07-29 |
| 5977628 | Semiconductor device mounted in resin sealed container | — | 1999-11-02 |
| 5394014 | Semiconductor device improved in light shielding property and light shielding package | Masahiko Ishikawa, Kohji Hayano, Shinichi Mori, Masayuki Yamashita, Osamu Ueda | 1995-02-28 |
| 5323058 | Semiconductor device including package with improved base-to-cop seal | — | 1994-06-21 |
| 5317195 | Semiconductor device improved in light shielding property and light shielding package | Masahiko Ishikawa, Kohji Hayano, Shinichi Mori, Masayuki Yamashita, Osamu Ueda | 1994-05-31 |