Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6112969 | Wire bonding apparatus | Hiroshi Horibe, Shinji Toyosaki | 2000-09-05 |
| 6105848 | Wire bonding method, wire bonding apparatus and semiconductor device produced by the same | Hiroshi Horibe, Shinji Toyosaki | 2000-08-22 |
| 5982042 | Semiconductor wafer including semiconductor device | — | 1999-11-09 |
| 5838071 | Wire bonding method, wire bonding apparatus and semiconductor device produced by the same | Hiroshi Horibe, Shinji Toyosaki | 1998-11-17 |