Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6112969 | Wire bonding apparatus | Hiroshi Horibe, Kazuko Nakamura | 2000-09-05 |
| 6105848 | Wire bonding method, wire bonding apparatus and semiconductor device produced by the same | Hiroshi Horibe, Kazuko Nakamura | 2000-08-22 |
| 5838071 | Wire bonding method, wire bonding apparatus and semiconductor device produced by the same | Hiroshi Horibe, Kazuko Nakamura | 1998-11-17 |