Issued Patents All Time
Showing 1–14 of 14 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10676365 | Hydrogenated silane composition | Takashi Abe | 2020-06-09 |
| 10676366 | Hydrogenated silane composition | Takashi Abe, Chiho Mizushima, Takuya Kamiyama | 2020-06-09 |
| 9764961 | Cyclohexasilane | Shin-ya Imoto, Takashi Abe, Morihiro KITAMURA, Hikaru Takahashi, Takehiko Morita | 2017-09-19 |
| 9617161 | Method for producing cyclohexasilane | Shin-ya Imoto, Takashi Abe, Morihiro KITAMURA, Hikaru Takahashi, Takehiko Morita | 2017-04-11 |
| 8652880 | Semiconductor device and method of manufacturing same | Koji Bando, Kazuyuki Misumi, Naoki Izumi, Akira Yamazaki | 2014-02-18 |
| 8524510 | Method for manufacturing magnetic memory chip device | Kazuyuki Misumi, Masahiro Shimizu, Tsuyoshi Koga, Tomohiro Murakami | 2013-09-03 |
| 8258604 | Semiconductor device and method of manufacturing same | Koji Bando, Kazuyuki Misumi, Naoki Izumi, Akira Yamazaki | 2012-09-04 |
| 8124425 | Method for manufacturing magnetic memory chip device | Kazuyuki Misumi, Masahiro Shimizu, Tsuyoshi Koga, Tomohiro Murakami | 2012-02-28 |
| 6583511 | Semiconductor device and a method of producing the same | Kazunari Michii | 2003-06-24 |
| 6545366 | Multiple chip package semiconductor device | Kazunari Michii | 2003-04-08 |
| 6255719 | Semiconductor device including thermal neutron absorption material | Hirotada Kuriyama, Kazuhito Tsutsumi, Yutaka Arita, Tadafumi Kishimoto | 2001-07-03 |
| 5659199 | Resin sealed semiconductor device | Ryuichiro Mori, Shunichi Abe, Michitaka Kimura | 1997-08-19 |
| 4942454 | Resin sealed semiconductor device | Ryuichiro Mori, Katsuyuki Fukudome, Yoshitaka Takemoto | 1990-07-17 |
| 4884124 | Resin-encapsulated semiconductor device | Ryuichiro Mori, Katsuyuki Fukudome | 1989-11-28 |