Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8881966 | Method of manufacturing semiconductor device, and wire bonder | Hideyuki Arakawa, Shunji Yamauchi, Mitsuru Aoki | 2014-11-11 |
| 8652880 | Semiconductor device and method of manufacturing same | Koji Bando, Tatsuhiko Akiyama, Naoki Izumi, Akira Yamazaki | 2014-02-18 |
| 8524510 | Method for manufacturing magnetic memory chip device | Masahiro Shimizu, Tsuyoshi Koga, Tatsuhiko Akiyama, Tomohiro Murakami | 2013-09-03 |
| 8258604 | Semiconductor device and method of manufacturing same | Koji Bando, Tatsuhiko Akiyama, Naoki Izumi, Akira Yamazaki | 2012-09-04 |
| 8124425 | Method for manufacturing magnetic memory chip device | Masahiro Shimizu, Tsuyoshi Koga, Tatsuhiko Akiyama, Tomohiro Murakami | 2012-02-28 |
| 8097942 | Semiconductor device including power supply bar having jutted portion, parallel running portion and bent portion and manufacturing method therefor | Katsuyuki Fukudome, Kazushi Hatauchi, Kazuya Fukuhara, Kunihiro Yamashita | 2012-01-17 |
| 7915719 | Semiconductor device | Kazushi Hatauchi | 2011-03-29 |
| 7763966 | Resin molded semiconductor device and differential amplifier circuit | Kazushi Hatauchi, Yasuki Takata, Naoya Yasuda, Hideyuki Arakawa, Katsuyuki Fukudome | 2010-07-27 |
| 7151316 | Semiconductor device | — | 2006-12-19 |
| 6841870 | Semiconductor device | — | 2005-01-11 |
| 6737733 | Sealed semiconductor device and lead frame used for the same | Kazunari Michii, Yoshihiro Hirata | 2004-05-18 |
| 6614101 | Lead frame with raised leads and plastic packaged semiconductor device using the same | Kazunari Michii, Manabu Horita | 2003-09-02 |
| 6552418 | Resin-encapsulated semiconductor device | Kazunari Michii | 2003-04-22 |