Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10192811 | Power semiconductor device | Tatsuya Fukase, Masaki Kato, Masahiko Fujita | 2019-01-29 |
| 6614101 | Lead frame with raised leads and plastic packaged semiconductor device using the same | Kazuyuki Misumi, Kazunari Michii | 2003-09-02 |
| 5500502 | Bonding method and apparatus | Masaharu Yoshida, Masataka Takehara | 1996-03-19 |