Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6369447 | Plastic-packaged semiconductor device including a plurality of chips | — | 2002-04-09 |
| 6163070 | Semiconductor package utilizing a flexible wiring substrate | — | 2000-12-19 |
| 5903049 | Semiconductor module comprising semiconductor packages | — | 1999-05-11 |
| 5659199 | Resin sealed semiconductor device | Shunichi Abe, Tatsuhiko Akiyama, Michitaka Kimura | 1997-08-19 |
| 5139969 | Method of making resin molded semiconductor device | — | 1992-08-18 |
| 5042123 | Computer controlled automated semiconductor production apparatus | — | 1991-08-27 |
| 4942454 | Resin sealed semiconductor device | Katsuyuki Fukudome, Tatsuhiko Akiyama, Yoshitaka Takemoto | 1990-07-17 |
| 4884124 | Resin-encapsulated semiconductor device | Tatsuhiko Akiyama, Katsuyuki Fukudome | 1989-11-28 |
| 4878610 | Die bonding apparatus | Syuichi Osaka, Toshinobu Banjo | 1989-11-07 |
| 4857989 | Semiconductor device | Katsuyuki Fukudome, Toshinobu Banjo | 1989-08-15 |