Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6907053 | Semiconductor laser device, and optical pickup apparatus using the device | Kenji Ohgiyama, Koji Yamashita, Toshio Takeuchi, Susumu Ishida, Kenji Kan | 2005-06-14 |
| 6288376 | Method and apparatus for melting a bump by induction heating | — | 2001-09-11 |
| RE35496 | Semiconductor device and method of producing the same | Ken Yamamura, Naoto Ueda, Kazunari Michii, Hitoshi Fujimoto, Hitoshi Sasaki +1 more | 1997-04-29 |
| 5565378 | Process of passivating a semiconductor device bonding pad by immersion in O.sub.2 or O.sub.3 solution | Shigeru Harada, Kimio Hagi | 1996-10-15 |
| 5334803 | Semiconductor device and method of producing the same | Ken Yamamura, Naoto Ueda, Kazunari Michii, Hitoshi Fujimoto, Hitoshi Sasaki +1 more | 1994-08-02 |
| 5293066 | Semiconductor device mounting structure including lead frame and lead plate | — | 1994-03-08 |
| 5229646 | Semiconductor device with a copper wires ball bonded to aluminum electrodes | — | 1993-07-20 |
| 5124277 | Method of ball bonding to non-wire bonded electrodes of semiconductor devices | — | 1992-06-23 |
| 5116783 | Method of producing semiconductor device | — | 1992-05-26 |
| 5093712 | Resin-sealed semiconductor device | Yoshihiro Matsunaga, Tadao Nishimori, Hiromasa Matsuoka, Kozo Shimamoto | 1992-03-03 |
| 5023697 | Semiconductor device with copper wire ball bonding | — | 1991-06-11 |
| 5003373 | Structure of electrode junction for semiconductor device | Hitoshi Fujimoto | 1991-03-26 |
| 4984056 | Semiconductor integrated circuit device | Hitoshi Fujimoto | 1991-01-08 |
| 4886200 | Capillary tip for bonding a wire | — | 1989-12-12 |
| 4821944 | Method for bonding a wire and bonding apparatus | — | 1989-04-18 |