Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6778377 | Electrostatic chucking system, and apparatus and method of manufacturing a semiconductor device using the electrostatic chucking system | — | 2004-08-17 |
| 6414395 | Semiconductor device capable of preventing disconnection in a through hole | Yuuko Ookuma | 2002-07-02 |
| 6304001 | Semiconductor device with alignment mark and manufacturing method thereof | Noboru Sekiguchi, Mitsuo Kimoto | 2001-10-16 |
| 5889330 | Semiconductor device whose flattening resin film component has a controlled carbon atom content | Hiroyuki Nishimura, Hiroshi Adachi, Etsushi Adachi, Shigeyuki Yamamoto, Shintaro Minami +2 more | 1999-03-30 |
| 5859478 | Semiconductor device including a main alignment mark having peripheral minute alignment marks | — | 1999-01-12 |
| 5728630 | Method of making a semiconductor device | Hiroyuki Nishimura, Hiroshi Adachi, Etsushi Adachi, Shigeyuki Yamamoto, Shintaro Minami +2 more | 1998-03-17 |
| 5604380 | Semiconductor device having a multilayer interconnection structure | Hiroyuki Nishimura, Hiroshi Adachi, Etsushi Adachi, Shigeyuki Yamamoto, Shintaro Minami +2 more | 1997-02-18 |
| 5565378 | Process of passivating a semiconductor device bonding pad by immersion in O.sub.2 or O.sub.3 solution | Shigeru Harada, Kiyoaki Tsumura | 1996-10-15 |
| 5480836 | Method of forming an interconnection structure | Shigeru Harada, Kazuhiro Ishimaru | 1996-01-02 |
| 5341026 | Semiconductor device having a titanium and a titanium compound multilayer interconnection structure | Shigeru Harada, Kazuhiro Ishimaru | 1994-08-23 |
| 5306947 | Semiconductor device and manufacturing method thereof | Hiroshi Adachi, Hirozoh Kanegae, Hiroshi Mochizuki, Masanori Obata, Takemi Endoh +4 more | 1994-04-26 |