Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| RE40746 | Ozonizer | Yujiro Okihara, Youichiro Tabata, Akaru Usui, Hiromichi Komiya, Yuji Ganryu +4 more | 2009-06-16 |
| 7108836 | Ozonizer | Yujiro Okihara, Youichiro Tabata, Akaru Usui, Hiromichi Komiya, Yuji Ganryu +4 more | 2006-09-19 |
| 6905659 | Ozonizer | Akaru Usui, Youichiro Tabata, Yujiro Okihara, Hiromichi Komiya, Yuji Ganryu +4 more | 2005-06-14 |
| 6869575 | Ozonizer | Youichiro Tabata, Yujiro Okihara, Akaru Usui, Hiromichi Komiya, Yuji Ganryu +4 more | 2005-03-22 |
| 6866829 | Ozonizer | Yujiro Okihara, Youichiro Tabata, Akaru Usui, Hiromichi Komiya, Yuji Ganryu +4 more | 2005-03-15 |
| 5939472 | Epoxy resin composition for molding having improved mechanical properties and crack resistance | Hiromi Ito, Takumi Kikuchi, Hirofumi Fujioka, Yoshifumi Itabashi, Fumio Nogami | 1999-08-17 |
| 5880179 | Molded products for high voltage apparatus comprising brominated epoxy resins | Hiromi Ito, Takumi Kikuchi, Hirofumi Fujioka, Yoshifumi Itabashi, Fumio Nogami | 1999-03-09 |
| 5798070 | Encapsulation method | Kunito Sakai, Kazuharu Oshio | 1998-08-25 |
| 5597523 | Molding apparatus and method in which a mold cavity gasket is deformed by separately applied pressure | Kunito Sakai, Kazuharu Oshio | 1997-01-28 |
| 5395226 | Molding machine and method | Kunito Sakai, Kazuharu Oshio | 1995-03-07 |
| 5306947 | Semiconductor device and manufacturing method thereof | Hiroshi Adachi, Hiroshi Mochizuki, Masanori Obata, Takemi Endoh, Kimio Hagi +4 more | 1994-04-26 |
| 5180691 | Method of manufacturing a semiconductor device sealed with molding resin employing a stress buffering film of silicone | Etsushi Adachi, Hiroshi Adachi, Hiroshi Mochizuki | 1993-01-19 |
| 5114994 | Epoxy resin composition for sealing semiconductor | Hiromi Ito, Ichiro Takahashi | 1992-05-19 |