Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5798070 | Encapsulation method | Kazuharu Oshio, Hirozoh Kanegae | 1998-08-25 |
| 5597523 | Molding apparatus and method in which a mold cavity gasket is deformed by separately applied pressure | Kazuharu Oshio, Hirozoh Kanegae | 1997-01-28 |
| 5395226 | Molding machine and method | Kazuharu Oshio, Hirozoh Kanegae | 1995-03-07 |
| 5082615 | Method for packaging semiconductor devices in a resin | — | 1992-01-21 |
| 4963307 | Method for producing a tablet for resin-molding semiconductor devices and resin-molding method making use of the tablet | Sueyosi Tanaka, Yasutugu Tutumi, Yutaka Morita | 1990-10-16 |
| 4826931 | Tablet for resin-molding semiconductor devices | Sueyosi Tanaka, Yasutugu Tutumi, Yutaka Morita | 1989-05-02 |
| 4812420 | Method of producing a semiconductor device having a light transparent window | Sadamu Matsuda, Takashi Takahama | 1989-03-14 |
| 4769344 | Method of resin encapsulating a semiconductor device | Sadamu Matsuda, Takashi Takahama | 1988-09-06 |
| 4717948 | Semiconductor device | Akinobu Tamaki, Takashi Takahama | 1988-01-05 |
| 4697203 | Semiconductor device and manufacturing method therefor | Sadamu Matsuda, Takashi Takahama | 1987-09-29 |