Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6402497 | Mold clamping device with improved clamping force transmission mechanism | Masataka Takehara, Shinichi Hasegawa, Haruo Yoshida | 2002-06-11 |
| 5210055 | Method for the plasma treatment of semiconductor devices | Shinji Nakaguma | 1993-05-11 |