Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6854671 | Nozzle for ejecting molten metal | Jyunichi Aizawa, Hiroshi Fukumoto | 2005-02-15 |
| 6213356 | Bump forming apparatus and bump forming method | Masaharu Yoshida, Makoto Kanda, Hiroshi Fukumoto | 2001-04-10 |
| 5305944 | Bonding method and bonding apparatus | Masaharu Yoshida, Masataka Takehara | 1994-04-26 |