Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10921767 | Encoder system | Akihiro Kobayashi, Shigeru Itoh, Hiroshi Nishikawa, Wataru Furuichi, Kiyoshige Taga +1 more | 2021-02-16 |
| 10789144 | Supervisory circuit, supervisory system, motor control system | Akihiro Kobayashi, Shigeru Itoh, Hiroshi Nishikawa, Wataru Furuichi, Kiyoshige Taga +1 more | 2020-09-29 |
| 7794299 | Method for manufacturing image display device, image display device, and TV apparatus | Masahiro Tagawa, Tomokazu Andoh, Takahiro Oguchi | 2010-09-14 |
| 7544522 | Fabrication method of semiconductor integrated circuit device | Koji Watanabe, Daisuke HIROTA | 2009-06-09 |
| 7390235 | Method for manufacturing image display device, image display device, and TV apparatus | Masahiro Tagawa, Tomokazu Andoh, Takahiro Oguchi | 2008-06-24 |
| 7088036 | Method for manufacturing image display device, image display device, and TV apparatus | Masahiro Tagawa, Tomokazu Andoh, Takahiro Oguchi | 2006-08-08 |
| 7005741 | Liquid crystal display device and/or circuit substrate including bump electrodes and electrode pads | Atsushi Ono, Yasunori Chikawa, Norimitsu Nie, Satoru Tone, Motoji Shiota +2 more | 2006-02-28 |
| 6998295 | Method of manufacturing a device package | Yasunari Shiraishi | 2006-02-14 |
| 6933607 | Semiconductor device with bumps on electrode pads oriented in given direction | Atsushi Ono, Yasunori Chikawa, Norimitsu Nie, Satoru Tone, Motoji Shiota +2 more | 2005-08-23 |
| 6901093 | Semiconductor laser device | Yasunori Hosokawa, Kenji Ohgiyama | 2005-05-31 |
| 6760001 | Method of adjusting characteristics of electron source, method of manufacturing electron emission device | Takahiro Oguchi, Akihiko Yamano | 2004-07-06 |
| 6611504 | Mobile wireless device | Yoshio Koyanagi | 2003-08-26 |
| 6525422 | Semiconductor device including bump electrodes | Atsushi Ono, Yasunori Chikawa, Norimitsu Nie, Satoru Tone, Motoji Shiota +2 more | 2003-02-25 |
| 6452281 | Semiconductor integrated circuit and fabrication process therefor | — | 2002-09-17 |
| 6281510 | Sample transferring method and sample transfer supporting apparatus | Shusuke Yoshitake, Yoshiaki Tsukumo, Ryoichi Hirano, Toru Tojo, Yoshiaki Tada | 2001-08-28 |
| 6213356 | Bump forming apparatus and bump forming method | Yasufumi Nakasu, Masaharu Yoshida, Hiroshi Fukumoto | 2001-04-10 |
| 6090176 | Sample transferring method and sample transfer supporting apparatus | Shusuke Yoshitake, Yoshiaki Tsukumo, Ryoichi Hirano, Toru Tojo, Yoshiaki Tada | 2000-07-18 |
| 5302801 | Laser bonding apparatus | Masaharu Yoshida | 1994-04-12 |
| 5250781 | Laser bonding apparatus | Masaharu Yoshida | 1993-10-05 |
| 5009590 | Method and apparatus for preheating semiconductor chips | Tadashi Mitarai | 1991-04-23 |