Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8883566 | Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure | Tadahiro Morifuji, Chuichi Miyazaki, Toshihide Uematsu, Yoshiyuki Abe | 2014-11-11 |
| 8729698 | Method of manufacturing semiconductor device, semiconductor device and multilayer wafer structure | Tadahiro Morifuji, Chuichi Miyazaki, Toshihide Uematsu, Yoshiyuki Abe | 2014-05-20 |
| 8546244 | Method of manufacturing semiconductor device | Yoshiyuki Abe, Chuichi Miyazaki, Toshihide Uematsu | 2013-10-01 |
| 6475829 | Semiconductor device and manufacturing method thereof | Kazushi Hatauchi | 2002-11-05 |
| 6046071 | Plastic molded semiconductor package and method of manufacturing the same | Akiyoshi Sawai, Toru Tachikawa, Jun Shibata | 2000-04-04 |
| 5834340 | Plastic molded semiconductor package and method of manufacturing the same | Akiyoshi Sawai, Toru Tachikawa, Jun Shibata | 1998-11-10 |
| 5710062 | Plastic molded semiconductor package and method of manufacturing the same | Akiyoshi Sawai, Toru Tachikawa, Jun Shibata | 1998-01-20 |
| 5554887 | Plastic molded semiconductor package | Akiyoshi Sawai, Toru Tachikawa, Jun Shibata | 1996-09-10 |
| 5548482 | Semiconductor integrated circuit apparatus including clamped heat sink | Kazushi Hatauchi | 1996-08-20 |
| 5412157 | Semiconductor device | Hideya Yagoura, Noriaki Higuchi | 1995-05-02 |
| 5359203 | Laser OLB apparatus and method of mounting semiconductor device | Mitsuya Hashii, Hideya Yagoura | 1994-10-25 |
| 5309021 | Semiconductor device having particular power distribution interconnection arrangement | Jun Shibata, Toru Tachikawa, Tetsuya Ueda, Hiroshi Seki | 1994-05-03 |
| 5220196 | Semiconductor device | Kazunari Michii, Masataka Takehara | 1993-06-15 |
| 5166099 | Manufacturing method for semiconductor device | Tetsuya Ueda, Osami Nakagawa, Yasuhiro Teraoka, Seiji Takemura | 1992-11-24 |
| 5157478 | Tape automated bonding packaged semiconductor device incorporating a heat sink | Tetsuya Ueda, Yasuhiro Teraoka, Hideya Yagoura, Hiroshi Seki | 1992-10-20 |
| 5064706 | Carrier tape including molten resin flow path element for resin packaged semiconductor devices | Tetsuya Ueda, Hideya Yagoura, Hiroshi Seki, Yasuhiro Teraoka | 1991-11-12 |
| 4865193 | Tape carrier for tape automated bonding process and a method of producing the same | Tetsuya Ueda | 1989-09-12 |
| 4839713 | Package structure for semiconductor device | Yasuhiro Teraoka, Tetsuya Ueda, Hideya Yagoura, Shigeyuki Nango, Toshinobu Banjo +1 more | 1989-06-13 |
| 4826068 | Outer lead bonding device utilizing tape carriers | Hideya Yagoura | 1989-05-02 |