Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5166099 | Manufacturing method for semiconductor device | Tetsuya Ueda, Osami Nakagawa, Haruo Shimamoto, Seiji Takemura | 1992-11-24 |
| 5157478 | Tape automated bonding packaged semiconductor device incorporating a heat sink | Tetsuya Ueda, Haruo Shimamoto, Hideya Yagoura, Hiroshi Seki | 1992-10-20 |
| 5064706 | Carrier tape including molten resin flow path element for resin packaged semiconductor devices | Tetsuya Ueda, Haruo Shimamoto, Hideya Yagoura, Hiroshi Seki | 1991-11-12 |
| 4839713 | Package structure for semiconductor device | Tetsuya Ueda, Hideya Yagoura, Haruo Shimamoto, Shigeyuki Nango, Toshinobu Banjo +1 more | 1989-06-13 |