AS

Akiyoshi Sawai

Mitsubishi Electric: 13 patents #2,044 of 25,717Top 8%
RE Ryoden Semiconductor System Engineering: 4 patents #17 of 195Top 9%
📍 Kasai, JP: #664 of 5,842 inventorsTop 15%
Overall (All Time): #374,416 of 4,157,543Top 10%
13
Patents All Time

Issued Patents All Time

Showing 1–13 of 13 patents

Patent #TitleCo-InventorsDate
11311970 Shielding gas nozzle for metal forming and laser metal forming apparatus Yoshikazu Nakano, Hidetaka KATOGI 2022-04-26
6457876 Surface-mountable optical device 2002-10-01
6451622 Optical device 2002-09-17
6256875 Method for manufacturing semiconductor device Masaki Watanabe, Yoshikazu Narutaki, Tomoaki Hashimoto, Masatoshi Yasunaga, Jun Shibata +3 more 2001-07-10
6177724 Semiconductor device 2001-01-23
6046071 Plastic molded semiconductor package and method of manufacturing the same Haruo Shimamoto, Toru Tachikawa, Jun Shibata 2000-04-04
6005289 Package for semiconductor device laminated printed circuit boards Masaki Watanabe, Yoshikazu Narutaki, Tomoaki Hashimoto, Masatoshi Yasunaga, Jun Shibata +3 more 1999-12-21
5903048 Lead frame for semiconductor device Kouji Bandou, Hideki Hukunaga 1999-05-11
5834340 Plastic molded semiconductor package and method of manufacturing the same Haruo Shimamoto, Toru Tachikawa, Jun Shibata 1998-11-10
5814883 Packaged semiconductor chip Kisamitsu Ono, Hideyuki Ichiyama, Katsunori Asai 1998-09-29
5710062 Plastic molded semiconductor package and method of manufacturing the same Haruo Shimamoto, Toru Tachikawa, Jun Shibata 1998-01-20
5666008 Flip chip semiconductor device Yoshihiro Tomita, Katsunori Asai 1997-09-09
5554887 Plastic molded semiconductor package Haruo Shimamoto, Toru Tachikawa, Jun Shibata 1996-09-10