Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5900582 | Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame | Yoshihiro Tomita, Naoto Ueda, Yoshirou Nishinaka, Shunichi Abe | 1999-05-04 |
| 5814883 | Packaged semiconductor chip | Akiyoshi Sawai, Kisamitsu Ono, Katsunori Asai | 1998-09-29 |
| 5763829 | Leadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframe | Yoshihiro Tomita, Naoto Ueda, Yoshirou Nishinaka, Shunichi Abe | 1998-06-09 |
| 5724726 | Method of making leadframe for lead-on-chip (LOC) semiconductor device | Yoshihiro Tomita, Naoto Ueda, Yoshirou Nishinaka, Shunichi Abe | 1998-03-10 |
| 5592019 | Semiconductor device and module | Tetsuya Ueda, Kisamitsu Ono, Kou Shimomura | 1997-01-07 |
| 5535509 | Method of making a lead on chip (LOC) semiconductor device | Yoshihiro Tomita, Naoto Ueda, Yoshirou Nishinaka, Shunichi Abe | 1996-07-16 |
| 5372295 | Solder material, junctioning method, junction material, and semiconductor device | Shunichi Abe, Katunori Asai, Yoshihiro Tomita, Seizou Ohumae, Yoshirou Nishinaka +3 more | 1994-12-13 |
| 5373190 | Resin-sealed semiconductor device | — | 1994-12-13 |
| 5207102 | Semiconductor pressure sensor | Yoshiharu Takahashi, Tetsuya Hirose | 1993-05-04 |
| 4974052 | Plastic packaged semiconductor device | — | 1990-11-27 |