Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5592019 | Semiconductor device and module | Tetsuya Ueda, Kisamitsu Ono, Hideyuki Ichiyama | 1997-01-07 |
| 5196917 | Carrier tape | Tetsuya Ueda, Osamu Nakagawa, Seiji Takemura, Kazunari Michii | 1993-03-23 |
| 5034436 | Semiconductor sealing epoxy resin composition | Ichiro Takahashi, Hiromi Ito, Goro Okamoto, Kazuo Okahashi | 1991-07-23 |
| 4824801 | Method of manufacturing aluminum bonding pad with PSG coating | Hiroshi Kawashimo, Kouichi Nakagawa | 1989-04-25 |