Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6530512 | Wire bonding apparatus and wire bonding method | — | 2003-03-11 |
| 6020625 | Lead frame including hanging leads and hanging lead reinforcement in a semiconductor device including the lead frame | Zhi-Kang Qin, Yoshiharu Takahashi | 2000-02-01 |
| 5207786 | Wire bonding method | — | 1993-05-04 |
| 4824801 | Method of manufacturing aluminum bonding pad with PSG coating | Kouichi Nakagawa, Kou Shimomura | 1989-04-25 |