Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5900582 | Lead frame including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the lead frame | Yoshihiro Tomita, Naoto Ueda, Shunichi Abe, Hideyuki Ichiyama | 1999-05-04 |
| 5763829 | Leadframe including frame-cutting slit for lead-on-chip (LOC) semiconductor device and semiconductor device incorporating the leadframe | Yoshihiro Tomita, Naoto Ueda, Shunichi Abe, Hideyuki Ichiyama | 1998-06-09 |
| 5724726 | Method of making leadframe for lead-on-chip (LOC) semiconductor device | Yoshihiro Tomita, Naoto Ueda, Shunichi Abe, Hideyuki Ichiyama | 1998-03-10 |
| 5609287 | Solder material, junctioning method, junction material, and semiconductor device | Goro Izuta, Shunichi Abe, Katsuyuki Fukutome, Naoto Ueda, Toshio Takeuchi +2 more | 1997-03-11 |
| 5535509 | Method of making a lead on chip (LOC) semiconductor device | Yoshihiro Tomita, Naoto Ueda, Shunichi Abe, Hideyuki Ichiyama | 1996-07-16 |
| 5372295 | Solder material, junctioning method, junction material, and semiconductor device | Shunichi Abe, Katunori Asai, Yoshihiro Tomita, Hideyuki Ichiyama, Seizou Ohumae +3 more | 1994-12-13 |