Issued Patents All Time
Showing 25 most recent of 133 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431430 | Technologies for high throughput additive manufacturing for integrated circuit components | Aleksandar Aleksov, Feras Eid, Adel A. Elsherbini, Wenhao Li, Stephen L. Morein | 2025-09-30 |
| 12304366 | Vehicle seat and vehicle seat manufacturing method | Yoichi Tachikawa, Kohei Taguchi, Tsukasa Meguro | 2025-05-20 |
| 12183596 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh | 2024-12-31 |
| 11955434 | Ultra small molded module integrated with die by module-on-wafer assembly | Eric J. Li, Shawna M. Liff, Javier A. Falcon, Joshua D. Heppner | 2024-04-09 |
| 11764080 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh | 2023-09-19 |
| 11387200 | Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric | Georgios Dogiamis, Telesphor Kamgaing, Javier A. Falcon, Vijay K. Nair | 2022-07-12 |
| 11335651 | Microelectronic devices designed with compound semiconductor devices and integrated on an inter die fabric | Telesphor Kamgaing, Georgios Dogiamis, Vijay K. Nair, Javier A. Falcon, Shawna M. Liff | 2022-05-17 |
| 11328937 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh | 2022-05-10 |
| 11272612 | Flexible substrate | — | 2022-03-08 |
| 11075166 | Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate | Eric J. Li, Timothy A. Gosselin, Shawna M. Liff, Amram Eitan, Mark Saltas | 2021-07-27 |
| 10925158 | Flexible substrate | — | 2021-02-16 |
| 10790231 | Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate | Eric J. Li, Timothy A. Gosselin, Shawna M. Liff, Amram Eitan, Mark Saltas | 2020-09-29 |
| 10764999 | Flexible substrate | — | 2020-09-01 |
| 10741419 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh | 2020-08-11 |
| 10636716 | Through-mold structures | Sasha N. Oster, Srikant Nekkanty, Joshua D. Heppner, Adel A. Elsherbini, Debendra Mallik +2 more | 2020-04-28 |
| 10629551 | Microelectronic devices with high frequency communication modules having compound semiconductor devices integrated on a package fabric | Georgios Dogiamis, Telesphor Kamgaing, Javier A. Falcon, Vijay K. Nair | 2020-04-21 |
| 10573608 | Microelectronic devices designed with high frequency communication devices including compound semiconductor devices integrated on a die fabric on package | Georgios Dogiamis, Telesphor Kamgaing, Eric J. Li, Javier A. Falcon, Vijay K. Nair +1 more | 2020-02-25 |
| 10418329 | Microelectronic structures having multiple microelectronic devices connected with a microelectronic bridge embedded in a microelectronic substrate | Eric J. Li, Timothy A. Gosselin, Shawna M. Liff, Amram Eitan, Mark Saltas | 2019-09-17 |
| 10403512 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh | 2019-09-03 |
| 10365172 | Tactile sensor that includes two sheets each having at least either flexibility or elasticity | Koichi Hirano, Susumu Sawada, Hideki Ohmae | 2019-07-30 |
| 10228806 | Flexible touch sensor and method of manufacturing the same | Koji Kawakita, Koichi Hirano, Masanori Nomura, Susumu Sawada, Takashi Ichiryu | 2019-03-12 |
| 10163810 | Electromagnetic interference shielding for system-in-package technology | Eric J. Li, Nachiket R. Raravikar, Robert L. Sankman | 2018-12-25 |
| 10111368 | Flexible substrate retention on a reusable carrier | Joshua D. Heppner | 2018-10-23 |
| 10070520 | Magnetic particle embedded flex or printed flex for magnetic tray or electro-magnetic carrier | Joshua D. Heppner, Shawna M. Liff, Pramod Malatkar | 2018-09-04 |
| 9991243 | Integrated circuit assembly that includes stacked dice | Omkar G. Karhade, Nitin A. Deshpande, Bassam M. Ziadeh | 2018-06-05 |