Issued Patents All Time
Showing 26–50 of 133 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9942980 | Wavy interconnect for bendable and stretchable devices | Chuan Hu, Adel A. Elsherbini, Shawna M. Liff | 2018-04-10 |
| 9899238 | Low cost package warpage solution | Omkar G. Karhade, Nitin A. Deshpande, Debendra Mallik, Bassam M. Ziadeh | 2018-02-20 |
| 9866898 | Elementary stream multiplexing method, multiplexing system, encoding or decoding method and apparatus | Kazuhiro Yamashita, Yousuke Yamaguchi, Takafumi Kamito, Yasuo Misuda, Yosuke Takabayashi | 2018-01-09 |
| 9859248 | Laser die backside film removal for integrated circuit (IC) packaging | Danish Faruqui, Edward R. Prack, Sergei Voronov, David K. Wilkinson, JR., Tony Dambrauskas +3 more | 2018-01-02 |
| 9860979 | Stretchable flexible substrate including first insulating layer, second insulating layer, first metal layer, and second metal layer | Takashi Ichiryu, Koji Kawakita, Masanori Nomura | 2018-01-02 |
| 9844133 | Flexible substrate including stretchable sheet | Koichi Hirano, Susumu Sawada, Koji Kawakita, Takashi Ichiryu, Masanori Nomura | 2017-12-12 |
| 9793233 | Forming sacrificial composite materials for package-on-package architectures and structures formed thereby | Rajasekaran Swaminathan, Leonel Arana, Yosuke Kanaoka | 2017-10-17 |
| 9685388 | Picture frame stiffeners for microelectronic packages | Jiro Kubota, Omkar G. Karhade, Shawna M. Liff, Kinya Ichikawa, Nitin A. Deshpande | 2017-06-20 |
| 9678272 | Flexible optical substrate | Susumu Sawada | 2017-06-13 |
| 9576942 | Integrated circuit assembly that includes stacked dice | Omkar G. Karhade, Nitin A. Deshpande, Bassam M. Ziadeh | 2017-02-21 |
| 9543197 | Package with dielectric or anisotropic conductive (ACF) buildup layer | Chuan Hu, Dingying Xu | 2017-01-10 |
| 9502368 | Picture frame stiffeners for microelectronic packages | Jiro Kubota, Omkar G. Karhade, Shawna M. Liff, Kinya Ichikawa, Nitin A. Deshpande | 2016-11-22 |
| 9472519 | Forming sacrificial composite materials for package-on-package architectures and structures formed thereby | Rajasekaran Swaminathan, Leonel Arana, Yosuke Kanaoka | 2016-10-18 |
| 9412702 | Laser die backside film removal for integrated circuit (IC) packaging | Danish Faruqui, Edward R. Prack, Sergei Voronov, David K. Wilkinson, JR., Tony Dambrauskas +3 more | 2016-08-09 |
| 9380697 | Electronic device and manufacturing method for same | Mitsuhiro Kasahara | 2016-06-28 |
| 9373762 | Electronic part package | Susumu Sawada, Koji Kawakita, Masanori Nomura | 2016-06-21 |
| 9263329 | Methods of connecting a first electronic package to a second electronic package | Chia-Pin Chiu, Kinya Ichikawa, Robert L. Sankman, Eric J. Li | 2016-02-16 |
| 9165482 | Display device and method for manufacturing the same | Takeshi Suzuki, Koichi Hirano, Yasuhiro Arai | 2015-10-20 |
| 9006887 | Forming sacrificial composite materials for package-on-package architectures and structures formed thereby | Rajasekaran Swaminathan, Leonel Arana, Yosuke Kanaoka | 2015-04-14 |
| 8723574 | Semiconductor integrated circuit | — | 2014-05-13 |
| 8691683 | Flip-chip mounting method and bump formation method | Koichi Hirano, Seiji Karashima, Takashi Ichiryu, Seiichi Nakatani | 2014-04-08 |
| 8669648 | Power semiconductor module | — | 2014-03-11 |
| 8518750 | Flexible interconnect pattern on semiconductor package | David Chau, Gregory M. Chrysler, Devendra Natekar | 2013-08-27 |
| 8513792 | Package-on-package interconnect stiffener | Sanka Ganesan, Yosuke Kanaoka, Ram Viswanath, Rajasekaran Swaminathan, Robert M. Nickerson +2 more | 2013-08-20 |
| 8409924 | Flexible interconnect pattern on semiconductor package | David Chau, Gregory M. Chrysler, Devendra Natekar | 2013-04-02 |