Issued Patents All Time
Showing 25 most recent of 194 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10030156 | Conductive paste for forming conductive film for semiconductor devices, semiconductor device, and method for producing semiconductor device | Kazuya Takagi, Kenichi Harigae, Nobuo Ochiai, Masashi Nakayama, Kairi Otani +1 more | 2018-07-24 |
| 9825209 | Electronic component package and method for manufacturing the same | Kazuma Mima, Yoshihisa Yamashita, Koji Kawakita, Susumu Sawada | 2017-11-21 |
| 9627583 | Light-emitting device and method for manufacturing the same | Susumu Sawada, Koji Kawakita, Yoshihisa Yamashita | 2017-04-18 |
| 9595651 | Electronic component package and method for manufacturing same | Yoshihisa Yamashita, Koji Kawakita, Susumu Sawada | 2017-03-14 |
| 9541518 | Electrochemical detector and method for producing same | Yoshihisa Yamashita, Tetsuyoshi Ogura, Koichi Hirano, Makoto Takahashi, Satoshi Arimoto | 2017-01-10 |
| 9449937 | Semiconductor device and method for manufacturing the same | Koji Kawakita, Susumu Sawada, Yoshihisa Yamashita | 2016-09-20 |
| 9449944 | Electronic component package and method for manufacturing same | Susumu Sawada, Yoshihisa Yamashita, Koji Kawakita | 2016-09-20 |
| 9425122 | Electronic component package and method for manufacturing the same | Koji Kawakita, Susumu Sawada, Yoshihisa Yamashita | 2016-08-23 |
| 9426899 | Electronic component assembly | Takashi Kitae, Seiji Karashima | 2016-08-23 |
| 9368469 | Electronic component package and method of manufacturing same | Yoshihisa Yamashita, Koji Kawakita, Susumu Sawada | 2016-06-14 |
| 9330811 | Transparent electrode and method for manufacturing the same | Takashi Ichiryu, Yoshihisa Yamashita | 2016-05-03 |
| 9320155 | Ceramic substrate composite and method for manufacturing ceramic substrate composite | Taiji Kuroiwa, Yoshihisa Yamashita, Susumu Sawada | 2016-04-19 |
| 9236338 | Built-up substrate, method for manufacturing same, and semiconductor integrated circuit package | Koji Kawakita, Susumu Sawada, Yoshihisa Yamashita | 2016-01-12 |
| 9107306 | Hybrid substrate, method for manufacturing the same, and semiconductor integrated circuit package | Koji Kawakita | 2015-08-11 |
| 9076714 | Substrate for mounting light-emitting element and light-emitting device | Tatsuo Ogawa, Kazuo Kimura, Shigetoshi Segawa | 2015-07-07 |
| 8975626 | Flexible semiconductor device | Takeshi Suzuki, Kenichi Hotehama, Koichi Hirano | 2015-03-10 |
| 8895373 | Method for manufacturing flexible semiconductor device having gate electrode disposed within an opening of a resin film | Takeshi Suzuki, Kenichi Hotehama, Koichi Hirano, Tatsuo Ogawa | 2014-11-25 |
| 8887383 | Electrode structure and method for forming bump | Yasushi Taniguchi, Takashi Kitae, Seiji Karashima, Kenichi Hotehama | 2014-11-18 |
| 8709293 | Flip-chip mounting resin composition and bump forming resin composition | Takashi Kitae, Seiji Karashima, Koichi Hirano, Toshiyuki Kojima, Shingo Komatsu +1 more | 2014-04-29 |
| 8691683 | Flip-chip mounting method and bump formation method | Koichi Hirano, Seiji Karashima, Takashi Ichiryu, Yoshihiro Tomita | 2014-04-08 |
| 8617943 | Method for making a semiconductor device on a flexible substrate | Takashi Ichiryu, Koichi Hirano, Yoshihisa Yamashita, Shingo Komatsu | 2013-12-31 |
| 8593720 | Electronic paper and method for producing same | Koichi Hirano, Masami Nakagawa | 2013-11-26 |
| 8581247 | Flexible semiconductor device having gate electrode disposed within an opening of a resin film | Takeshi Suzuki, Kenichi Hotehama, Koichi Hirano, Tatsuo Ogawa | 2013-11-12 |
| 8525172 | Flexible semiconductor device | Koichi Hirano, Tatsuo Ogawa, Takashi Ichiryu, Takeshi Suzuki | 2013-09-03 |
| 8525178 | Flexible semiconductor device and method for producing the same | Takashi Ichiryu, Koichi Hirano | 2013-09-03 |