Issued Patents All Time
Showing 25 most recent of 28 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8871567 | Field-effect transistor and method for manufacturing the same | Koichi Hirano, Yasuteru Saito, Naoki Ike | 2014-10-28 |
| 8709293 | Flip-chip mounting resin composition and bump forming resin composition | Takashi Kitae, Seiji Karashima, Koichi Hirano, Toshiyuki Kojima, Seiichi Nakatani +1 more | 2014-04-29 |
| 8617943 | Method for making a semiconductor device on a flexible substrate | Takashi Ichiryu, Seiichi Nakatani, Koichi Hirano, Yoshihisa Yamashita | 2013-12-31 |
| 8344264 | Semiconductor device and manufacturing process thereof | Yutaka Kumano, Hideki Iwaki, Tetsuyoshi Ogura, Koichi Hirano | 2013-01-01 |
| 8039307 | Mounted body and method for manufacturing the same | Toshiyuki Kojima, Seiichi Nakatani, Yoshihisa Yamashita, Takashi Kitae | 2011-10-18 |
| 7977741 | Manufacturing method of flexible semiconductor device and flexible semiconductor device | Koichi Hirano, Seiichi Nakatani, Yoshihisa Yamashita, Takashi Ichiryu | 2011-07-12 |
| 7921551 | Electronic component mounting method | Yoshihisa Yamashita, Seiji Karashima, Takashi Kitae, Seiichi Nakatani, Toshiyuki Kojima | 2011-04-12 |
| 7911064 | Mounted body and method for manufacturing the same | Seiichi Nakatani, Seiji Karashima, Toshiyuki Kojima, Takashi Kitae, Yoshihisa Yamashita | 2011-03-22 |
| 7888789 | Transfer material used for producing a wiring substrate | Yasuhiro Sugaya, Koichi Hirano, Seiichi Nakatani, Yasuyuki Matsuoka, Toshiyuki Asahi +1 more | 2011-02-15 |
| 7851281 | Manufacturing method of flexible semiconductor device and flexible semiconductor device | Koichi Hirano, Seiichi Nakatani, Yoshihisa Yamashita, Takashi Ichiryu | 2010-12-14 |
| 7713787 | Mounted body and method for manufacturing the same | Toshiyuki Kojima, Seiichi Nakatani, Yoshihisa Yamashita, Takashi Kitae | 2010-05-11 |
| 7611040 | Method for forming solder bump and method for mounting semiconductor device using a solder powder resin composition | Takashi Kitae, Seiichi Nakatani, Toshiyuki Kojima, Yoshihisa Yamashita | 2009-11-03 |
| 7390692 | Semiconductor device and method for manufacturing the same | Yasuhiro Sugaya, Toshiyuki Asahi, Yoshiyuki Yamamoto, Seiichi Nakatani | 2008-06-24 |
| 7294587 | Component built-in module and method for producing the same | Toshiyuki Asahi, Yasuhiro Sugaya, Yoshiyuki Yamamoto, Seiichi Nakatani | 2007-11-13 |
| 7198996 | Component built-in module and method for producing the same | Seiichi Nakatani, Yasuhiro Sugaya, Toshiyuki Asahi | 2007-04-03 |
| 7157789 | Semiconductor device and method for manufacturing the same | Koichi Hirano, Yoshiyuki Yamamoto, Seiichi Nakatani, Toshiyuki Kojima | 2007-01-02 |
| 7132756 | Semiconductor device and method for manufacturing the same | Yasuhiro Sugaya, Toshiyuki Asahi, Yoshiyuki Yamamoto, Seiichi Nakatani | 2006-11-07 |
| 7018866 | Circuit component built-in module with embedded semiconductor chip and method of manufacturing | Yasuhiro Sugaya, Toshiyuki Asahi, Yoshiyuki Yamamoto, Seiichi Nakatani, Satoru Yuhaku +1 more | 2006-03-28 |
| 6975516 | Component built-in module and method for producing the same | Toshiyuki Asahi, Yasuhiro Sugaya, Yoshiyuki Yamamoto, Seiichi Nakatani | 2005-12-13 |
| 6955948 | Method of manufacturing a component built-in module | Toshiyuki Asahi, Yasuhiro Sugaya, Seiichi Nakatani | 2005-10-18 |
| 6939738 | Component built-in module and method for producing the same | Seiichi Nakatani, Yasuhiro Sugaya, Toshiyuki Asahi | 2005-09-06 |
| 6936774 | Wiring substrate produced by transfer material method | Yasuhiro Sugaya, Koichi Hirano, Seiichi Nakatani, Yasuyuki Matsuoka, Toshiyuki Asahi +1 more | 2005-08-30 |
| 6871396 | Transfer material for wiring substrate | Yasuhiro Sugaya, Koichi Hirano, Seiichi Nakatani, Yasuyuki Matsuoka, Toshiyuki Asahi +1 more | 2005-03-29 |
| 6855892 | Insulation sheet, multi-layer wiring substrate and production processes thereof | Seiichi Nakatani, Yasuhiro Sugaya, Toshiyuki Asahi, Yoshiyuki Yamamoto | 2005-02-15 |
| 6784530 | Circuit component built-in module with embedded semiconductor chip and method of manufacturing | Yasuhiro Sugaya, Toshiyuki Asahi, Yoshiyuki Yamamoto, Seiichi Nakatani, Satoru Yuhaku +1 more | 2004-08-31 |